PCBAMake offers one-stop PCB and PCBA manufacturing services, from PCB production to final product assembly. We provide efficient and flexible solutions to turn your ideas into reality.
| Assembly Type | Typical Volume |
|---|---|
| PCB Prototype | 1–20 pcs |
| Early Production | 20–50 pcs |
| NPI | 50–100 pcs |
| Small Batch | 100–1000 pcs |
| Medium Volume | 1000–10000 pcs |
| High Volume | 10000+ pcs |
We support small-batch customized production of single-sided, double-sided, multi-layer, high-frequency, flexible, and rigid-flex boards to meet diverse design requirements.
With access to global supply chain resources, we ensure the quality and reliability of components. Our dedicated warehouse in HK helps save on import taxes and shipping costs.
With 3 advanced SMT assembly lines, 2 manual insertion lines, and professional testing equipment, we ensure the performance and quality of every product.
Our quality control includes AOI, X-ray, FPT, and visual inspection. Every order undergoes strict quality checks and inspections before shipment.
From product assembly to custom enclosures, packaging, and logistics, we provide one-stop delivery services to bring your products to global markets seamlessly.
We offer professional free DFM checks during small-batch PCB assembly, thoroughly reviewing your design files (Gerber, BOM, assembly drawings, schematics). Our engineering team ensures manufacturability and assembly readiness, safeguarding your production.
Ordering small-batch PCB assemblies saves costs and allows errors to be identified and corrected at the right time. In contrast, errors in large-volume production can lead to significant losses and wasted time.
High-Speed Modular Patch Machine
(Panasonic NPM-D3)
Universal High Precision Patch Machine
(Panasonic NPM-TT)
Refund welding Machine
Selective Wave Soldering
(Germany Ersa)
You may have only a few BGAs or fine pitch parts on your PC boards that require PCB assembly for R&D prototyping. We provide a specialized BGA soldering service for testing and evaluation purposes and we can assist you with BGA rework and BGA reballing at an affordable price!
We follow five basic steps to perform BGA rework: component removal, site preparation, solder paste application, BGA replacement, and Reflow Soldering. We guarantee that 100% of your boards will be fully functional when they are returned to you.
PBGA, short for plastic ball grid array, was invented by Motorola and now has received the widest focus and applications.
TBGA, short for tape ball grid array, is capable of effectively shrinking package thickness and providing excellent electrical performance.
As is its name defined, CBGA (ceramic ball grid array) packages take advantage of ceramic as substrate material and tin balls (ratio between tin and lead: 10:90) with high melting point.
We mostly use X-ray inspection for analyzing the features of BGA PCBs. This technique is known as XRD in the industry and relies on X-rays for unveiling the hidden features of this PCB. This kind of inspection reveals,
