PCBAMake has been providing BGA assembly, including BGA Rework and BGA Reballing services in the Printed Circuit Board Assembly industry since 2003. With state-of-the-art BGA placement equipment, high-precision BGA assembly processes, cutting-edge X-Ray Inspection equipment, and highly customizable Complete PCB Assembly solutions, you can rely on us to build high quality and high yield BGA boards.

BGA (Ball Grid Array) assembly is one of the most advanced SMT (Surface Mount Technology) processes used in modern electronics manufacturing.

At PCBAMake, we specialize in precision BGA soldering and rework, ensuring reliable connections, strong mechanical integrity, and excellent electrical performance for complex PCB designs.

Our production line supports various BGA types — from standard BGAs to micro-BGA and CSP packages — enabling high-density circuit assembly for advanced applications.