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What is a HDI PCB?

HDI PCB represents High Density Interconnect Printed Circuit Board. It is an advanced technology in multilayer circuit boards and are among the fastest-growing solutions in the industry. These boards sit on a high-density substrate with routing and pad connections compared to standard PCBs.

Designed for compact and high-performance applications, HDI PCBs feature significantly higher wiring density than conventional boards. They are typically based on a laminated structure with double-sided or multilayer cores, making them lighter, thinner, shorter, and smaller.

HDI technology enables greater miniaturization of electronic products while delivering enhanced performance and efficiency, meeting the demands of modern, high-tech designs.

Features of PCBAMake HDI PCB
If you are developing complex electronic products, you need durable, reliable, and high-performance HDI PCBs. With PCBAMake’s advanced HDI manufacturing capabilities, we deliver customized solutions tailored to your specific needs.
Since 1996, PCBAMake has been committed to supporting innovation and meeting the challenges of increasingly sophisticated technologies. One of our core values is uncompromising quality in every circuit board we produce. To ensure this, we apply rigorous quality control measures at every stage of the manufacturing process, including:
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  • Blind and/or buried vias
  • Min. Line Width/Space: 0.05/0.05mm
  • Via-in-pad
  • Through vias from surface to surface
  • 20 μm circuit geometries
  • 30 μm dielectric layers
  • 50 μm laser vias
  • 125 μm bump pitch processing
  • Surface Finish: ENIG/OSP/HASL/Au Plating (soft/hard)/ Immersion Ag/ Immersion Tin/ Bright Tin Plating/Ag Plating/Carbon Ink
PCBAMake HDI PCB
We're capable of manufacturing HDI PCB up to 40 layers in various structures, check the following table for our available HDI PCB structures:
HDI Structures Type of Microvias Mass Production Small /Middle Batch Prototype Layers Availible
1+N+1 Blind vias Yes Yes Yes 4 layers+
2+N+2 Blind/Buried staggered vias Yes Yes Yes 4 layers+
2+N+2 Blind/Buried stacked vias Yes Yes Yes 6 layers+
3+N+3 Blind/Buried staggered vias / Yes Yes 8 layers+
3+N+3 Blind/Buried Stacked Vias / / Yes 8 layers+
HDI PCB Capability
ITEM Capability
Layers 1-28
Thicker Copper 1-6OZ
Products Type HF(High-Frequency)&(Radio Frequency) board, Impedance controlled board , HDI board ,BGA& Fine Pitch board
Solder Mask Nanya&Taiyo ;LPI & Matt Red, green, yellow,white, blue,black.
Base material FR4(Shengyi China、ITEQ, KB A+,HZ), HI-TG, FR06, Rogers,Taconic、Argon、Nalco、Isola and so on
Finished Surface Conventional HASL,Lead-free HASL,Falsh Gold, ENIG (Immersion Gold)OSP(Entek), Immersion Tin,ImmersionSilver,Hard Gold
Selective Surface Treatment ENIG(immersion Gold)+OSP, ENIG(immersion Gold)+Gold Finger,Flash Gold +Gold Finger, immersion Silver+ Gold Finger, Immersion Tin+Gold Finger
Technical Specification Minimum line width/gap:3.5/4mil(laser drill)
Minimum hole size:0.15mm(mechanical drill)/4mil(laser drill)
Minimum Annular Ring: 4mil
Max Copper thickness: 6OZ
Max Production size:900×1200mm
Board Thickness:D/S: 0.2-7.0mm, Multilayers:0.40-7.0mm,
Min Solder Mask Bridge:0.08mm
Aspect ratio: 15:1
Plugging Visa capability: 0.2-0.8mm
Tolerance Plated holes Tolerance:0.08mm(min±0.05)
Non-plated hole tolerance:0.05min(min+0/-0.05mm or +0.05/-0mm)
Outline Tolerance:0.15min(min±0.10mm)
Functional test :
Insulating resistance : 50 ohms (mormality)
Peel off strength: 1.4N/mm
Thermal Stress test :2650c,20 seconds
Solder mask hardness:6H
E-Test voltage :500V+15/-0V 30S
Warp and Twist: 0.7% (semiconductor test board≤0.3% )
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HDI PCB Application

Consumer Electronics
Consumer Electronics
Medical Equipment
Medical Equipment
Automotive Applications
Automotive Applications

Why Choose PCBAMake For Your HDI PCB?

Over 20 years of PCB experience
PCBAMake has been delivering high-density interconnect printed circuit boards for more than 20 years, and we believe no order is too small, and no tolerance is too tight. Pair that with competitive pricing, quick quotes and response times, domestic and offshore manufacturing and an unprecedented level of flexibility, and you have a winning combination for all your HDI PCB needs.
Benefits
Shorter PCB manufacturing time-to-market and enhanced machine performance for Flip Chip, BGA, MCM, SIP technologies.
Advanced technology
Ultra thin cores, fine line geometries and alternative via methods for improved thermal transfer for thermal PCBs. In compliance with 20um circuit geometries, 30um dielectric layers, 50um laser vias and 125um bump pitch processing.
Short delivery time
Allows reducing the lead times by combining the manufacturing capabilities with a profound understanding of high speed digital and high frequency RF package requirements.
Better design
Increases the area for PCB designer to place electronical components and also enhances faster signal transmission and reduced signal loss. Our high HDI PCB boards have the technology-driving capabilities to bring applications in a large number of industries including but not limited to semiconductor test equipment, military weapons, medical, and aerospace.
FAQ
Q
How long have you been making PCB&PCBA?
A
PCBAMake has been making PCBs for more than 26 years.We built our assembly plant and begin assembly business in 1996.
Q
How do I get a quick quote for PCB or PCB assembly?
A
Please send your files and requirements to Orders@pcbamake.com. Quote will be sent back as soon as we get through an evaluation.
Q
Do you cater SMT prototype boards?
A
Yes, we are fully equipped to handle your any kind of custom SMT prototype board requirements. MOQ is 10 PCS.
Q
What files and documents do you request for my PCBA orders?
A
To ensure accurate and efficient assembly, we require Gerber files, BOM in Excel format, Centroid data, and assembly instructions if applicable.

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