A: PCBAMake is manufacturer specializing in 1-40layer PCB prototyping, low-volume production and PCB Assembly service under one stop contract solution. PCBAMake based in shenzhen, serving the world. PCBAMake strives to be the easiest manufacturer for engineers to work with and the lifelong partners for your products brand.

A: We order components in bulk if they are common and out of stock. For standard parts we typically keep in inventory, you pay little or nothing.

For uncommon BOM items, we procure a 5% overage or 5 spare parts (based on size/cost) to prevent shortages due to production loss—covered at our cost, so you incur no extra charges.

If any BOM issues arise (e.g., high MOQs), we’ll collaborate on solutions. Our 35-member sourcing team ensures 24-hour to 7-day quotes (depending on BOM complexity) and procures parts globally, leveraging long-term local supplier relationships (10+ years) and international channels for competitive pricing.

A: The total lead time depends on component procurement and PCB assembly. To optimize efficiency, we overlap processes: once we receive your Gerber files and BOM, we begin stencil preparation and PCB fabrication in parallel with parts sourcing.

For details, see our PCBA capabilities.

A: Yes, we do partial assemblies. Please tell us which components you do not want to be placed by noting in your BOM “Do Not Include (DNI)” or DNP ( Do not Placed ) or NO need assembly.

A: SMT Assembly involves the following:

Application of solder paste
Placing the components
Soldering the boards with a reflow process.

A: Yes, a combination of both manual soldering and automated soldering can be used. Manual soldering only for prototypes if no special request (machine is a must)

A: SMT PCB come with a wide range of advantages, the most important ones being the fact that they are suited for printed circuit boards which offer small size and reduced weight.

A: Yes. This practice is called partial Turn-key. You can supply some parts, and we source the rest of the parts on your behalf. We will ask for your approval for anything that is not sure at our side. In case parts crossing or substitution is needed, we will again ask for your final approval.

A: Design Requirements:

Via-on-pad: Must be resin-filled for reliable soldering.
Via-near-pad: Must be tented/solder-mask-filled to prevent defects.
We ensure high-quality BGA assembly through strict process controls.