| Feature | Technical specification |
|---|---|
| Number of layers | 1-40 layer |
| Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
| Board Thickness | 0.1mm – 0.8mm |
| Materials | Polyimide, Polyester |
| Copper weights (finished) | 0.5oz – 2.0oz |
| Minimum track and gap | 0.075mm / 0.075mm |
| PCB thickness | 0.40mm – 3.20mm |
| Maximum dimensions | 610mm x 450mm; dependent upon laser drilling machine |
| Surface finishes available | HASL – Hot air solder leveling Lead – free HASL – RoHS ENIG – RoHS Immersion Tin – RoHS OSP – RoHS |
| Min Tracing/Spacing | 3mil/3mil |
| Board Size | Min 6*6mm, Max 406*610mm |
| Max. Array Size | 1-40 layer |
| Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
| Max. Array Size | 500*600mm / 250*1500mm(Special) |
| Min.board Size | 1 *1mm |
| Max.Board thickness | 0.23mm / 0.4mm(Special) |
| Min,Board thickness | 0.075mm / 0.065 mm(Special) |
| Board thickness | Tolerance ±0.03 mm |
|
