Rogers RO4350B is a widely used ceramic-filled hydrocarbon laminate for high-frequency PCB manufacturing. This premium RF substrate stands out among common high-frequency materials for its stable electrical performance and reliable process compatibility. It serves as the core substrate for custom RO4350B high-frequency PCBs applied in 5G communication, RF radio frequency and wireless signal transmission equipment.
Stable dielectric performance is its biggest technical advantage. RO4350B material maintains a fixed dielectric constant of 3.48±0.05 at 10 GHz. The tight Dk tolerance supports precise impedance control, which is essential for consistent RF signal transmission. It also features an ultra-low dissipation factor of 0.0037 at 10 GHz. This effectively reduces high-frequency signal attenuation and transmission loss, ensuring complete signal integrity for high-speed communication circuits.
Excellent thermal and mechanical stability guarantees long-term operational reliability. RO4350B high-frequency PCB boasts a Tg value over 280°C and a low Z-axis CTE of 32 ppm/°C. It resists thermal deformation, layer delamination and dimensional changes under continuous high-temperature operation. Its thermal conductivity reaches 0.69 W/m·K, enabling efficient heat dissipation for high-power RF modules and avoiding performance degradation caused by heat accumulation.
This Rogers high-frequency material offers great fabrication flexibility. It can be processed with standard FR-4 manufacturing workflows, balancing high-frequency performance and production cost. It supports multi-layer stacking, hybrid lamination with FR-4 and various surface finishes including ENIG and immersion silver. Thanks to its stable batch consistency and wide frequency adaptability from 500MHz to 77GHz, RO4350B PCB material is the preferred choice for base station circuits, radar modules and industrial RF communication devices.
Rogers RO4350B Standard Material Specification Parameters
Below are the authoritative and commonly used technical parameters of RO4350B high-frequency PCB laminate, covering electrical, thermal, mechanical and safety properties to support high-frequency PCB design and manufacturing validation.
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Parameterkategorie
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Technischer Punkt
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Typical Value
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Test Condition & Standard
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|---|---|---|---|
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Elektrische Eigenschaften
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Dielektrizitätskonstante (Dk)
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3.48 ± 0.05
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10GHz, IPC-TM-650
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|
Dissipation Factor (Df)
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0.0037
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10GHz, low signal loss performance
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|
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Volumenwiderstand
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1.7×10¹⁰ MΩ·cm
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Condition A, room temperature
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|
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Surface Resistivity
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4.2×10⁹ MΩ
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Standard atmospheric environment
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|
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Dielectric Breakdown Strength
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500 V/mil
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Insulation reliability test
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|
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Arc Resistance
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125 sec
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Anti-arc performance verification
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|
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Thermische Eigenschaften
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Glass Transition Temperature (Tg)
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＞280°C
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TMA test, IPC-TM-650
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|
Thermal Decomposition Temperature (Td)
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390°C
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TGA thermal stability test
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|
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Z-axis CTE
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32 ppm/°C
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Low thermal expansion, improves PTH reliability
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|
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Wärmeleitfähigkeit
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0.69 W/m·K
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80°C working condition
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|
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Mechanische Eigenschaften
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Biegefestigkeit
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255 MPa
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IPC-TM-650 standard
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Tensile Strength (Y-direction)
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175 MPa
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ASTM D638, room temperature
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|
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Moisture Absorption
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0.06%
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50°C, 48h immersion test
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|
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Safety Grade
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Flame Retardant Rating
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UL 94 V-0
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Industry standard fire resistance
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Application Range
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Working Frequency
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500MHz – 77GHz
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Suitable for full-band RF high-frequency circuits
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These stable parameter indicators make custom RO4350B high-frequency PCB ideal for high-precision RF circuits, 5G base station modules and microwave communication equipment. It maintains consistent electrical and mechanical performance even in long-term high-frequency and high-temperature working environments.
