ANPSE provides professional BGA assembly services, including BGA rework and BGA reballing for printed circuit board assembly projects. Equipped with advanced BGA placement equipment, high-precision soldering processes and state-of-the-art X-Ray inspection systems, we deliver highly customizable PCB assembly solutions to produce high-quality, high-yield BGA boards.
BGA (Ball Grid Array) assembly is one of the most sophisticated SMT (Surface Mount Technology) processes widely used in modern electronics manufacturing.
At ANPSE, we specialize in precision BGA soldering and rework, ensuring reliable interconnections, robust mechanical integrity and excellent electrical performance for complex PCB designs.
Our production line supports a wide range of BGA package types — from standard BGA, micro-BGA to CSP packages — enabling high-density circuit assembly for advanced applications in communications, medical devices, automotive electronics and industrial control.
BGA PCB layout allows us to efficiently use the available space. Hence, we can mount more components and manufacturer lighter devices.
The most BGA PCB design is smaller in size so they are faster to manufacture. Hence, we get higher manufacturing yields and the process becomes more convenient.
We use solid solder balls for manufacturing BGA leads. Hence, there is a lesser risk that they will get damaged during operation.
The smaller size and the convenient manufacturing route ensure that we incur lower manufacturing costs. Hence, this process is ideal for mass production.
