Rogers RO4350B is a widely used ceramic-filled hydrocarbon laminate for high-frequency PCB manufacturing. This premium RF substrate stands out among common high-frequency materials for its stable electrical performance and reliable process compatibility. It serves as the core substrate for custom RO4350B high-frequency PCBs applied in 5G communication, RF radio frequency and wireless signal transmission equipment.
Stable dielectric performance is its biggest technical advantage. RO4350B material maintains a fixed dielectric constant of 3.48±0.05 at 10 GHz. The tight Dk tolerance supports precise impedance control, which is essential for consistent RF signal transmission. It also features an ultra-low dissipation factor of 0.0037 at 10 GHz. This effectively reduces high-frequency signal attenuation and transmission loss, ensuring complete signal integrity for high-speed communication circuits.
Excellent thermal and mechanical stability guarantees long-term operational reliability. RO4350B high-frequency PCB boasts a Tg value over 280°C and a low Z-axis CTE of 32 ppm/°C. It resists thermal deformation, layer delamination and dimensional changes under continuous high-temperature operation. Its thermal conductivity reaches 0.69 W/m·K, enabling efficient heat dissipation for high-power RF modules and avoiding performance degradation caused by heat accumulation.
This Rogers high-frequency material offers great fabrication flexibility. It can be processed with standard FR-4 manufacturing workflows, balancing high-frequency performance and production cost. It supports multi-layer stacking, hybrid lamination with FR-4 and various surface finishes including ENIG and immersion silver. Thanks to its stable batch consistency and wide frequency adaptability from 500MHz to 77GHz, RO4350B PCB material is the preferred choice for base station circuits, radar modules and industrial RF communication devices.
罗杰斯 RO4350B 标准材料规格参数
以下是 RO4350B 高频 PCB 层压板的权威且常用的技术参数，涵盖电气、热学、机械和安全性能，以支持高频 PCB 的设计和制造验证。.
|
参数类别
|
技术项目
|
典型值
|
测试条件与标准
|
|---|---|---|---|
|
电学性能
|
介电常数（Dk）
|
3.48 ± 0.05（简体中文（大陆））
|
10GHz，IPC-TM-650
|
|
损耗因数（Df）
|
0.0037
|
10GHz，低信号损耗性能
|
|
|
体积电阻率
|
1.7×10¹⁰ MΩ·cm
|
条件A，室温
|
|
|
表面电阻率
|
4.2×10⁹ 兆欧
|
标准大气环境
|
|
|
介电击穿强度
|
500 V/mil
|
绝缘可靠性试验
|
|
|
抗电弧性
|
125 秒
|
抗电弧性能验证
|
|
|
热学性能
|
玻璃化转变温度（Tg）
|
＞280°C
|
TMA测试，IPC-TM-650
|
|
热分解温度（Td）
|
390°C
|
TGA热稳定性试验
|
|
|
Z轴热膨胀系数
|
32 ppm/°C
|
热膨胀系数低，可提高通孔（PTH）的可靠性
|
|
|
热导率
|
0.69 W/m·K
|
80°C的工作条件
|
|
|
力学性能
|
抗弯强度
|
255 MPa
|
IPC-TM-650 标准
|
|
抗拉强度（Y方向）
|
175 MPa
|
ASTM D638，室温
|
|
|
吸湿性
|
0.06%
|
50°C，48小时浸泡试验
|
|
|
安全等级
|
阻燃等级
|
UL 94 V-0
|
行业标准的耐火性能
|
|
应用范围
|
工作频率
|
500MHz – 77GHz
|
适用于全频段射频高频电路
|
凭借这些稳定的参数指标，定制版 RO4350B 高频 PCB 非常适合用于高精度射频电路、5G 基站模块和微波通信设备。即使在长期的高频、高温工作环境下，它也能保持稳定的电气和机械性能。.
