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4层HDI印制电路板

Model : 4 Layer HDI PCB

材料:FR-4(Tg170)

Layer: 4L

颜色:绿色/白色

成品厚度:1.6毫米
铜板厚度:10Z
表面处理:ENIG

最小线宽/间距:3.5mil/3.5mil
Technical features: Stack-up 1+N+1

应用领域:通信电子

技术规格

The 4 Layer HDI PCB is one of the most cost-effective high-density circuit boards widely used in mid-to-high-end precision electronics. Different from standard 4-layer rigid PCB, this board adopts microvia technology and fine-line layout design to achieve denser wiring in limited board space. Custom 4 Layer HDI PCB balances compact structure, stable electrical performance and affordable manufacturing cost, making it the most popular intermediate HDI circuit board for miniaturized electronic products.
This board features reliable structural performance and excellent signal transmission capability. With professional inner layer alignment and precise microvia fabrication, 4 Layer HDI PCB effectively reduces circuit crosstalk and signal loss during high-speed operation. Its optimized stackup design lowers board thickness while maintaining sufficient rigidity, avoiding common issues such as poor conduction and unstable impedance found on ordinary multilayer PCBs. For lightweight and portable device design, high-precision 4 Layer HDI PCB provides more flexible wiring solutions compared with traditional rigid boards.
Thanks to its balanced performance and practical structure, high-reliability 4 Layer HDI PCB covers a broad range of civilian and industrial scenarios. It is commonly used in consumer portable electronics, smart wearable devices, automotive auxiliary control modules and industrial miniature sensing equipment. Stable, easy-to-assemble and cost-efficient, custom 4 Layer HDI PCB has become the preferred high-density circuit board solution for small-volume, high-precision electronic hardware projects.
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