HDI PCB represents High Density Interconnect Printed Circuit Board. It is an advanced technology in multilayer circuit boards and are among the fastest-growing solutions in the industry. These boards sit on a high-density substrate with routing and pad connections compared to standard PCBs.
Designed for compact and high-performance applications, HDI PCBs feature significantly higher wiring density than conventional boards. They are typically based on a laminated structure with double-sided or multilayer cores, making them lighter, thinner, shorter, and smaller.
HDI technology enables greater miniaturization of electronic products while delivering enhanced performance and efficiency, meeting the demands of modern, high-tech designs.
| HDI Structures | Type of Microvias | Mass Production | Small /Middle Batch | 原型 | Layers Availible |
|---|---|---|---|---|---|
| 1+N+1 | Blind vias | 是的 | 是的 | 是的 | 4 layers+ |
| 2+N+2 | Blind/Buried staggered vias | 是的 | 是的 | 是的 | 4 layers+ |
| 2+N+2 | Blind/Buried stacked vias | 是的 | 是的 | 是的 | 6 layers+ |
| 3+N+3 | Blind/Buried staggered vias | / | 是的 | 是的 | 8 layers+ |
| 3+N+3 | Blind/Buried Stacked Vias | / | / | 是的 | 8 layers+ |
| ITEM | 能力 |
|---|---|
| Layers | 1-28 |
| Thicker Copper | 1-6OZ |
| Products Type | HF(High-Frequency)&(Radio Frequency) board, Impedance controlled board , HDI board ,BGA& Fine Pitch board |
| 阻焊層 | Nanya&Taiyo ;LPI & Matt Red, green, yellow,white, blue,black. |
| Base material | FR4(Shengyi China、ITEQ, KB A+,HZ), HI-TG, FR06, Rogers,Taconic、Argon、Nalco、Isola and so on |
| Finished Surface | Conventional HASL,Lead-free HASL,Falsh Gold, ENIG (Immersion Gold)OSP(Entek), Immersion Tin,ImmersionSilver,Hard Gold |
| Selective Surface Treatment | ENIG(immersion Gold)+OSP, ENIG(immersion Gold)+Gold Finger,Flash Gold +Gold Finger, immersion Silver+ Gold Finger, Immersion Tin+Gold Finger |
| Technical Specification |
Minimum line width/gap:3.5/4mil(laser drill) Minimum hole size:0.15mm(mechanical drill)/4mil(laser drill) Minimum Annular Ring: 4mil Max Copper thickness: 6OZ Max Production size:900×1200mm Board Thickness:D/S: 0.2-7.0mm, Multilayers:0.40-7.0mm, Min Solder Mask Bridge:0.08mm Aspect ratio: 15:1 Plugging Visa capability: 0.2-0.8mm |
| 寬容 |
Plated holes Tolerance:0.08mm(min±0.05) Non-plated hole tolerance:0.05min(min+0/-0.05mm or +0.05/-0mm) Outline Tolerance:0.15min(min±0.10mm) Functional test : Insulating resistance : 50 ohms (mormality) Peel off strength: 1.4N/mm Thermal Stress test :2650c,20 seconds Solder mask hardness:6H E-Test voltage :500V+15/-0V 30S Warp and Twist: 0.7% (semiconductor test board≤0.3% ) |
