Rogers RO4003C is a widely specified ceramic-filled hydrocarbon laminate within the Rogers 4000 material family, commonly used for low-loss RF and microwave PCB fabrication. Unlike conventional PTFE substrates that demand complex, time-consuming processing, this material strikes a solid balance between stable high-frequency electrical performance and standard manufacturability. Tested at 10GHz, it maintains a fixed dielectric constant (Dk) of 3.38 and a low dissipation factor (Df) of 0.0027. These consistent electrical characteristics greatly reduce signal attenuation and phase deviation during continuous high-frequency operation, making RO4003C high frequency PCB a practical, dependable choice for most commercial wireless RF circuit designs.
Many design engineers favor RO4003C over generic high-frequency materials for its reliable structural and thermal stability. Built with woven glass reinforcement and a precision ceramic-filled composite formula, it holds steady dielectric properties even with fluctuating temperatures and operating frequencies. Standard FR-4 laminates often suffer noticeable dielectric drift at elevated frequency bands, which compromises signal quality. RO4003C avoids this issue entirely. It withstands prolonged high-frequency power cycling without measurable performance decay, securing stable signal integrity for compact, high-precision RF modules. This makes it ideal for 2.4GHz to 10GHz RF microwave circuits that require consistent, repeatable transmission performance.
From real-world material selection and mass production experience, Rogers RO4003C PCB delivers clear cost-performance benefits compared with equivalent high-frequency laminates, including RO4350B and traditional PTFE substrates. It features a lower Df rating, supporting cleaner signal transmission for antenna and filter circuits than RO4350B. Its biggest practical advantage, however, is full compatibility with standard FR-4 fabrication workflows. No specialized etching, plasma treatment or complex lamination procedures are required, which lowers processing difficulty and overall manufacturing costs significantly. High-end PTFE materials can achieve comparable low-loss results, yet they come with much higher material pricing and lower production yields. For cost-conscious RF projects that refuse to compromise basic high-frequency performance, RO4003C offers premium-grade characteristics at a reasonable production budget.
Its well-rounded performance and friendly production costs allow RO4003C low loss PCB to serve a wide spectrum of commercial and industrial high-frequency applications. It is the go-to substrate for custom printed antennas, broadband RF filters, power dividers and low-power front-end amplifier modules. In modern wireless infrastructure, it supports 5G micro base station radio units, as well as high-frequency circuitry for IoT transceivers, Bluetooth and LoRa communication modules. It also performs reliably in automotive high-frequency sensing systems and civilian microwave communication devices, easily meeting strict mass-production standards and long-term reliability requirements for mid-to-high-end RF electronic equipment.
Rogers RO4003C Official Performance Specification Table
All listed parameters are sourced from Rogers official datasheet and tested per industry standard conditions. This specification covers core electrical, thermal, mechanical and processing properties, supporting RO4003C high frequency PCB design, simulation and mass production validation.
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參數類別
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Performance Item
|
典型值
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Test Condition
|
單位
|
|---|---|---|---|---|
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電學性質
|
介電常數 (Dk)
|
3.38 ± 0.05
|
10GHz, 23℃
|
–
|
|
Design Dk (Simulation Value)
|
3.55
|
Impedance calculation
|
–
|
|
|
損耗因數 (Df)
|
0.0027
|
10GHz, 23℃
|
–
|
|
|
TCDk (Thermal Coefficient of Dk)
|
+40
|
-50℃ ~ 150℃
|
ppm/℃
|
|
|
熱學特性
|
熱導率
|
0.71
|
Room Temperature
|
W/m·K
|
|
CTE (X-axis)
|
11
|
-55℃ ~ 288℃
|
ppm/℃
|
|
|
CTE (Y-axis)
|
14
|
-55℃ ~ 288℃
|
ppm/℃
|
|
|
CTE (Z-axis)
|
46
|
-55℃ ~ 288℃
|
ppm/℃
|
|
|
Mechanical & Physical Properties
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Tensile Strength (X)
|
139
|
Standard Test
|
MPa
|
|
Tensile Strength (Y)
|
100
|
Standard Test
|
MPa
|
|
|
銅材剝離強度
|
1.05
|
1oz EDC foil after solder float
|
N/mm
|
|
|
Processing Specifications
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Standard Copper Weight
|
0.5oz / 1oz / 2oz
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Mass production
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oz/ft²
|
|
Available Thickness
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0.203mm ~ 1.524mm
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Industrial standard
|
mm
|
|
|
Fabrication Compatibility
|
Fully compatible with FR-4 process
|
印刷電路板製造
|
–
|
規格說明: All parameters are typical values of standard RO4003C hydrocarbon ceramic laminates. The material features stable low-loss performance across 2.4GHz to 10GHz frequency bands and supports reliable multi-layer PCB lamination for high-volume RF module production.
